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1

A Communication-Aware DNN Accelerator on ImageNet Using in-Memory Entry-Counting Based Algorithm-Circuit-Architecture Co-Design in 65nm CMOS

Zhu, Haozhe, Chen, Chixiao, Liu, Shiwei, Zou, Qiaosha, Wang, Mingyu, Zhang, Lihua, Zeng, Xiaoyang, Shi, C.-J. Richard

Journal:

IEEE Journal on Emerging and Selected Topics in Circuits and Systems

Year:

2020

File:

PDF, 10.08 MB

2020

2

[IEEE 2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC) - Singapore (2014.01.20-2014.01.23)] 2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC) - 3DLAT: TSV-based 3D ICs crosstalk minimization utilizing Less Adjacent Transition code

Zou, Qiaosha, Niu, Dimin, Cao, Yan, Xie, Yuan

Year:

2014

Language:

english

File:

PDF, 276 KB

english, 2014

3

Thermomechanical Stress-Aware Management for 3-D IC Designs

Zou, Qiaosha, Kursun, Eren, Xie, Yuan

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2017

Language:

english

File:

PDF, 1.12 MB

english, 2017

4

[IEEE 2013 14th International Symposium on Quality Electronic Design (ISQED 2013) - Santa Clara, CA (2013.3.4-2013.3.6)] International Symposium on Quality Electronic Design (ISQED) - Cost-driven 3D design optimization with metal layer reduction technique

Qiaosha Zou,, Jing Xie,, Yuan Xie,

Year:

2013

Language:

english

File:

PDF, 401 KB

english, 2013

5

[IEEE 2013 IEEE 31st International Conference on Computer Design (ICCD) - Asheville, NC, USA (2013.10.6-2013.10.9)] 2013 IEEE 31st International Conference on Computer Design (ICCD) - Low power multi-level-cell resistive memory design with incomplete data mapping

Niu, Dimin, Zou, Qiaosha, Xu, Cong, Xie, Yuan

Year:

2013

Language:

english

File:

PDF, 294 KB

english, 2013

6

[IEEE Conference Publications Design Automation and Test in Europe - Grenoble, France (2013.03.18-2013.03.22)] Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013 - Thermomechanical Stress-Aware Management for 3D IC Designs

Zou, Qiaosha, Zhang, Tao, Kursun, Eren, Xie, Yuan

Year:

2013

Language:

english

File:

PDF, 496 KB

english, 2013

7

[IEEE 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE 2012) - Dresden (2012.03.12-2012.03.16)] 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE) - 3DHLS: Incorporating high-level synthesis in physical planning of three-dimensional (3D) ICs

Yibo Chen,, Guangyu Sun,, Qiaosha Zou,, Yuan Xie,

Year:

2012

Language:

english

File:

PDF, 1.09 MB

english, 2012

8

[IEEE 2015 20th Asia and South Pacific Design Automation Conference (ASP-DAC) - Chiba, Japan (2015.1.19-2015.1.22)] The 20th Asia and South Pacific Design Automation Conference - Heterogeneous architecture design with emerging 3D and non-volatile memory technologies

Qiaosha Zou,, Poremba, Matthew, Rui He,, Wei Yang,, Zhao, Junfeng, Xie, Yuan

Year:

2015

Language:

english

File:

PDF, 1.36 MB

english, 2015

9

[ACM Press SLIP (System Level Interconnect Prediction) - San Francisco, CA, USA (2014.06.01-2014.06.02)] Proceedings of SLIP (System Level Interconnect Prediction) on System Level Interconnect Prediction Workshop - SLIP '14 - Compact Models and Model Standard for 2.5D and 3D Integration

Zou, Qiaosha, Xie, Yuan

Year:

2014

Language:

english

File:

PDF, 384 KB

english, 2014

10

[ACM Press the seventh IEEE/ACM/IFIP international conference - Taipei, Taiwan (2011.10.09-2011.10.14)] Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis - CODES+ISSS '11 - System-level design space exploration for three-dimensional (3D) SoCs

Zou, Qiaosha, Chen, Yibo, Xie, Yuan, Su, Alan

Year:

2011

Language:

english

File:

PDF, 407 KB

english, 2011

11

[ACM Press the 24th edition of the great lakes symposium - Houston, Texas, USA (2014.05.21-2014.05.23)] Proceedings of the 24th edition of the great lakes symposium on VLSI - GLSVLSI '14 - TSV power supply array electromigration lifetime analysis in 3D ICS

Zou, Qiaosha, Zhang, Tao, Xu, Cong, Xie, Yuan

Year:

2014

Language:

english

File:

PDF, 472 KB

english, 2014

12

Overview of 3D Architecture Design Opportunities and Techniques

Zhao, Jishen, Zou, Qiaosha, Xie, Yuan

Journal:

IEEE Design and Test

Year:

2015

Language:

english

File:

PDF, 282 KB

english, 2015

13

[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - A cost benefit analysis: The impact of defect clustering on the necessity of pre-bond tests

Zou, Qiaosha, Poremba, Matt, Xie, Yuan

Year:

2014

Language:

english

File:

PDF, 335 KB

english, 2014

14

[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - Designing vertical bandwidth reconfigurable 3D NoCs for many core systems

Zou, Qiaosha, Zhan, Jia, Fen Ge,, Poremba, Matt, Xie, Yuan

Year:

2014

Language:

english

File:

PDF, 565 KB

english, 2014

15

[ACM Press the 53rd Annual Design Automation Conference - Austin, Texas (2016.06.05-2016.06.09)] Proceedings of the 53rd Annual Design Automation Conference on - DAC '16 - Pinatubo

Li, Shuangchen, Xu, Cong, Zou, Qiaosha, Zhao, Jishen, Lu, Yu, Xie, Yuan

Year:

2016

Language:

english

File:

PDF, 443 KB

english, 2016

16

[IEEE 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Hangzhou, China (2016.10.25-2016.10.28)] 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Utilizing 3D ICs in architectures for neural networks

Qiaosha Zou,, Yuan Xie,

Year:

2016

Language:

english

File:

PDF, 235 KB

english, 2016